SUTE聚酰亞胺薄膜-薄膜復合類

產品名稱

Product Name

聚醯亞胺薄膜

Polyimide Film

厚度

Thickness

(mm)

0.0125～0.25±10%

(Upon requests)

拉伸強度

Tensile Strength

橫向 Min 115～165 Mpa, 縱向 Min 135～165 Mpa

Horizontal Min 115～165 Mpa, Vertical Min 135～165 Mpa

延伸率

Elongation

Min 35～60 %

熱收縮率

Heat Shrinkage

150c Max1.0 %

400c Max3.0 %

體積電阻

Volume Resistivity 200c

Min 1.0x10^10 (ohm.m)

表面電阻

Surface Resistivity

Min 1.0x10^13(ohm)

擊穿電壓

Dielectric Breakdown Voltage50Hz

110～170 KV/mm

介電常數

Permittivity 50Hz

3.2~3.5+0.4

損耗值正切

Loss tangent values 48~62Hz

Min 1.8x10^-3~Min 4.0x10^-3

產品特點

Product  Features

聚醯亞胺薄膜是世界上性能的薄膜類絕緣材料，由均苯四甲酸二酐（PMDA）和二胺基二苯醚（DDE）在強極性溶劑中經縮聚並流延成膜再經亞胺化而成。該膜具有優良的耐高低溫性、電氣絕緣性、粘結性、耐輻射性、耐介質性，能在－269℃～400℃的溫度範圍內長期使用，短時可達到400℃的高溫。

polyimide firm is the best thun-film type insulating material in nowadays world, using the polymerization of PMDA and DDE in strongly polar solvent, followed by cast film formation and imidization., which has a good property of resistance to heat, electrical insulation, adhesion, radioactive and chemical. It can be used in a long term during the temperature between -269℃. to 260℃.. it can also be used under 400℃. in a short term.